
JSEDM has successfully completed the development of its 12-inch Diamond Wire Saw, extending its single-crystal SiC cutting capability to 12-inch sizes.
As wide-bandgap semiconductor technology continues to advance, SiC materials are moving toward larger diameters, creating higher demands for stability, efficiency, and material utilization in ingot cutting.
The new 12-inch Diamond Wire Saw is specifically developed for large-diameter single-crystal SiC. Utilizing diamond wire cutting technology, the machine is designed to reduce material loss and cutting load while providing a more efficient and stable solution for large-diameter SiC ingot cutting.
The successful development of this 12-inch model marks another step forward for JSEDM in large-diameter SiC ingot cutting technology.
The new 12-inch Diamond Wire Saw will be officially showcased at the Industrial Development Administration (IDA) Pavilion at SEMICON Taiwan 2026. We sincerely invite you to visit us at Taipei Nangang Exhibition Center, Hall 1, 4F|Booth L0416 to discover our latest equipment and large-diameter single-crystal SiC cutting applications.
SEMICON Taiwan 2026
Date|September 2–4, 2026
Exhibition|Industrial Development Administration (IDA) Pavilion
Venue|Taipei Nangang Exhibition Center, Hall 1, 4F
Booth|L0416

