JSEDM successfully concluded its participation in SEMICON Taiwan 2026. During the exhibition, we engaged in in-depth discussions with companies from the semiconductor, advanced materials, and precision manufacturing industries, exchanging insights on various material and processing requirements while exploring the future development and applications of precision cutting technologies.

President of JSEDM at the Opening Ceremony of the IDA Pavilion at SEMICON Taiwan 2026.

As the semiconductor industry continues to advance toward larger wafers, advanced materials, and increasingly diverse manufacturing processes, we observed growing market demand for 12-inch wafer slicing, square wafer slicing, and complex-profile cutting throughout the exhibition. Achieving higher cutting efficiency and material utilization while maintaining processing quality and controlling overall manufacturing costs has become an increasingly important consideration for the industry.

In response to the rapid development of next-generation semiconductor materials and processes, JSEDM continues to invest in the in-house development and manufacturing of special-material cutting systems while working closely with industry partners to understand their actual processing requirements. Through our independently developed equipment, cutting technologies, and process integration capabilities, we aim to help customers accelerate the development of new materials and processes, improve production efficiency and material utilization, and effectively reduce overall processing costs.

During SEMICON Taiwan 2026, JSEDM also engaged in close discussions with the University of Arizona, as well as representatives from U.S. government and industry, exploring opportunities for further collaboration in academic research and industrial applications of special-material cutting technologies. Following the exhibition, the special-material cutting system showcased at SEMICON Taiwan 2026 is planned to be shipped to the United States, where it will serve as a platform for further technical research, process validation, and industry-academia collaboration. By combining equipment independently developed and manufactured in Taiwan with research and industry resources in the United States, JSEDM will continue to strengthen international collaboration and accelerate the development and practical application of special-material cutting technologies.

International Exchange at SEMICON Taiwan 2026

From Taiwan to the global market, JSEDM will continue to build on its core strength in independent research and development, advancing precision cutting technologies for semiconductor and advanced materials while working with industry and research partners worldwide to explore new possibilities in material processing.